PlayStation 5 (PS5): Difference between revisions

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~~{{Short description|~~Technical measurements and hardware details for PlayStation 5 repair and troubleshooting}}

Technical measurements and hardware details for PlayStation 5 repair and troubleshooting.

= PlayStation 5 (PS5) =

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== Cooling and Thermal Design ==

* ~~Cooling~~ system ~~overview~~

* Overview of the cooling system design

* ~~Fan types~~ and ~~sizes~~

* Blower-type centrifugal fan specifications and airflow characteristics

* Liquid metal application notes

* Liquid metal thermal interface application notes

* Common thermal failure points

* Dust accumulation within the cooling system

=== Advanced Thermal Design ===

The cooling system appears well engineered, but the SoC generates significant heat under load. To minimize hotspot formation and maintain thermal conductivity, liquid metal is used as the thermal interface material due to its high thermal transfer performance. During SMD rework on the PS5 mainboard, one of the first noticeable characteristics is how effectively the PCB itself contributes to heat dissipation, with a substantial thermal mass. The only missing feature would have been an advanced dust filtration system.

=== Fan Type ===

The system uses a blower-style centrifugal fan, chosen for its ability to generate high static pressure and sufficient airflow (CFM) required to cool the power-intensive SoC and dense heatsink assembly. While effective, this design also makes the console more susceptible to dust accumulation, as it draws air from the surrounding environment without a dedicated filtration system.

=== Liquid Metal ===

Liquid metal does not dry out or degrade in the same way as traditional thermal pastes. However, it introduces its own drawbacks, primarily the need for proper containment and isolation, since it remains in a liquid state and can migrate or leak if not properly secured. The damage caused by leaked liquid metal is often almost irreversible, as it can creep under BGA packages, corrode pads, short components, and lead to significant repair challenges.

==== Correct Application ====

This is critically important for proper, long-term, stable operation of the device. Use cotton swabs (Q-tips) to carefully remove the old liquid metal, do not spill it. Clean the surface with isopropyl alcohol (IPA). When reapplying, use cotton swabs to spread the liquid metal evenly, as shown in the picture.

{| class="wikitable"

|-

| [[File:Apply lm tim a.jpg|250px]]

| [[File:Apply lm tim b.jpg|150px]]

|-

| Apply 1g of LM.

| Evenly spread carefully with q-tip.

|}

=== Dust Accumulation ===

When used at floor level, the risk of dust intake increases significantly. Over time, dust can accumulate on the cooling fins, reducing airflow and heat dissipation. This can lead to a progressive thermal chain: initial thermal throttling, followed by reduced performance or stuttering, and in severe cases, an automatic thermal shutdown to protect the hardware.

To mitigate these issues, it is recommended to keep the console elevated above floor level to reduce exposure to dust and improve long-term cooling performance.

== Common thermal failure points ==

* Compact thermal design with limited heat dissipation headroom.

* Dust accumulation obstructing airflow paths and reducing cooling efficiency.

* SoC temperatures exceeding TjMax, triggering thermal throttling or abrupt shutdowns to prevent hardware damage.

== Internal Components ==

* ~~System~~-on-~~chip~~ (~~SoC~~)

This section documents all internal components that were either missing (knocked off) or identified as faulty during inspection and repair.

* Memory configuration

* Storage subsystem

=== HDMI Chip MN864739 ===

* Power delivery circuitry

* Markings Panasonic MN864739 [https://www.psdevwiki.com/ps5/MN864739 MN864739 Pin Out].

* Optical drive hardware (standard model only)

=== EDM-020 DFN12 Protection Switch 5v VBUS ===

Is the Playstation's USB PD / VBUS current limiting protection IC.

Markings AF01 [https://www.aosmd.com/res/datasheets/AOZ1351DI-01.pdf AOZ1351DI-01] IC in DFN12 package.

{| class="wikitable"

|-

| [[File:EDM-020 AF01 Protection Switch.jpg|250px]]

|-

| AOZ1351DI-01 IC location on EDM-020.

|}

=== EDM-010 SIE CX090061GG EMI/RFI suppression ===

The following components were identified during a repair of a PS5 console. Several surface-mount components had been knocked off the bottom side of the EDM-010 board revision, in the vicinity of the SIE CX090061GG IC. The components were reverse-engineered from the board to facilitate replacement.

{| class="wikitable"

|-

| [[File:Sony@Motherboard@Side B@EDM-010 (cut L upper c).jpg|250px]]

| [[File:Ferrite beads from doner.jpg|250px]]

| [[File:EDM-010 repair ferrite beads.jpg|150px]]

|-

| EDM-010 SIE CX090061GG EMI/RFI suppression.

| Ferrite beads from donor board.

| Repair.

|}

Replacing them with 1206-package ferrite beads within the specification range of:

~600–1000 Ω @ 100 MHz

Low DC resistance

~0.5–2 A rating

Replacement ferrite beads were salvaged from a donor Dell notebook mainboard, sourced from the 3.5 mm audio circuitry, a section known to use comparable EMI suppression components in the same 1206 package. The repair was successful; the device passed all post-repair testing and had no warranty returns.

== Common Hardware Issues ==

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* '''Resistance''' measurements are taken with the console powered off and disconnected from AC.

* '''Voltage''' measurements are taken with the console connected to AC power and in the specified power state.

==== Resistance Reference ====

===== EDM-020 =====

Advanced resistance-to-ground values on a working EDM-020 board.

See high-res images below for full details.

{| class="wikitable"

|-

| [[File:PS5_PCB_EDM-020_Side_A.jpg|250px]]

| [[File:PS5_PCB_EDM-020_Side_B.jpg|250px]]

|-

| PS5 PCB EDM-020 Side A.

| PS5 PCB EDM-020 Side B.

|}

==== Voltage Reference ====

===== EDM-020 =====

PS5 Voltage Reference Characterization During Idle State (User Select / Home Screen, Side B).

{| class="wikitable"

|-

| [[File:PS5 PCB EDM-020 Side B voltage reading idle.jpg|250px]]

| [[File:32mhz crystal under SIE CX090061GG.jpg|250px]]

|-

| PS5 PCB EDM-020 Side B.

| Crystal oscillator under SIE CX09006 chip.

|}

=== Standby Power Rails ===

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This section should be used in conjunction with the '''Diagnostics and Troubleshooting''' section for effective fault isolation.

== Service Manuals ==

=== PlayStation®5 BOARD SERVICE MANUAL 1st edition for EDM-020 BOARD ===

: [[File:863200180-sm-ps5-0043e-01-0-BOARD-SERVICE-MANUAL-1st-edition.pdf|thumb|EDM-020 Board Service Manual 1ste Edition (PDF).]]

== Repair Notes ==

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This page is provided for informational purposes only. Repairing electronic equipment involves risk of injury or damage. Always follow appropriate safety procedures.

We are not responsible for any damage, injury, or loss resulting from the use of this information or any attempt to repair or modify equipment described on this page.

This information is intended for professional repair technicians with appropriate training, tools, and experience.

We are '''not responsible''' for any damage, injury, or loss resulting from the use of this information or any attempt to repair or modify equipment described on this page.

@@ Line 1: / Line 1: @@
-{{Short description|Technical measurements and hardware details for PlayStation 5 repair and troubleshooting}}
+Technical measurements and hardware details for PlayStation 5 repair and troubleshooting.
 = PlayStation 5 (PS5) =
@@ Line 38: / Line 38: @@
 == Cooling and Thermal Design ==
-* Cooling system overview
+* Overview of the cooling system design
-* Fan types and sizes
+* Blower-type centrifugal fan specifications and airflow characteristics
-* Liquid metal application notes
+* Liquid metal thermal interface application notes
-* Common thermal failure points
+* Dust accumulation within the cooling system
+=== Advanced Thermal Design ===
+The cooling system appears well engineered, but the SoC generates significant heat under load. To minimize hotspot formation and maintain thermal conductivity, liquid metal is used as the thermal interface material due to its high thermal transfer performance. During SMD rework on the PS5 mainboard, one of the first noticeable characteristics is how effectively the PCB itself contributes to heat dissipation, with a substantial thermal mass. The only missing feature would have been an advanced dust filtration system.
+=== Fan Type ===
+The system uses a blower-style centrifugal fan, chosen for its ability to generate high static pressure and sufficient airflow (CFM) required to cool the power-intensive SoC and dense heatsink assembly. While effective, this design also makes the console more susceptible to dust accumulation, as it draws air from the surrounding environment without a dedicated filtration system.
+=== Liquid Metal ===
+Liquid metal does not dry out or degrade in the same way as traditional thermal pastes. However, it introduces its own drawbacks, primarily the need for proper containment and isolation, since it remains in a liquid state and can migrate or leak if not properly secured. The damage caused by leaked liquid metal is often almost irreversible, as it can creep under BGA packages, corrode pads, short components, and lead to significant repair challenges.
+==== Correct Application ====
+This is critically important for proper, long-term, stable operation of the device. Use cotton swabs (Q-tips) to carefully remove the old liquid metal, do not spill it. Clean the surface with isopropyl alcohol (IPA). When reapplying, use cotton swabs to spread the liquid metal evenly, as shown in the picture.
+{| class="wikitable"
+|-
+| [[File:Apply lm tim a.jpg|250px]]
+| [[File:Apply lm tim b.jpg|150px]]
+|-
+| Apply 1g of LM.
+| Evenly spread carefully with q-tip.
+|}
+=== Dust Accumulation ===
+When used at floor level, the risk of dust intake increases significantly. Over time, dust can accumulate on the cooling fins, reducing airflow and heat dissipation. This can lead to a progressive thermal chain: initial thermal throttling, followed by reduced performance or stuttering, and in severe cases, an automatic thermal shutdown to protect the hardware.
+To mitigate these issues, it is recommended to keep the console elevated above floor level to reduce exposure to dust and improve long-term cooling performance.
+== Common thermal failure points ==
+* Compact thermal design with limited heat dissipation headroom.
+* Dust accumulation obstructing airflow paths and reducing cooling efficiency.
+* SoC temperatures exceeding TjMax, triggering thermal throttling or abrupt shutdowns to prevent hardware damage.
 == Internal Components ==
-* System-on-chip (SoC)
+This section documents all internal components that were either missing (knocked off) or identified as faulty during inspection and repair.
-* Memory configuration
-* Storage subsystem
+=== HDMI Chip MN864739 ===
-* Power delivery circuitry
+* Markings Panasonic MN864739 [https://www.psdevwiki.com/ps5/MN864739 MN864739 Pin Out].
-* Optical drive hardware (standard model only)
+=== EDM-020 DFN12 Protection Switch 5v VBUS ===
+Is the Playstation's USB PD / VBUS current limiting protection IC.
+Markings AF01 [https://www.aosmd.com/res/datasheets/AOZ1351DI-01.pdf AOZ1351DI-01] IC in DFN12 package.
+{| class="wikitable"
+|-
+| [[File:EDM-020 AF01 Protection Switch.jpg|250px]]
+|-
+| AOZ1351DI-01 IC location on EDM-020.
+|}
+=== EDM-010 SIE CX090061GG EMI/RFI suppression ===
+The following components were identified during a repair of a PS5 console. Several surface-mount components had been knocked off the bottom side of the EDM-010 board revision, in the vicinity of the SIE CX090061GG IC. The components were reverse-engineered from the board to facilitate replacement.
+{| class="wikitable"
+|-
+| [[File:Sony@Motherboard@Side B@EDM-010 (cut L upper c).jpg|250px]]
+| [[File:Ferrite beads from doner.jpg|250px]]
+| [[File:EDM-010 repair ferrite beads.jpg|150px]]
+|-
+| EDM-010 SIE CX090061GG EMI/RFI suppression.
+| Ferrite beads from donor board.
+| Repair.
+|}
+Replacing them with 1206-package ferrite beads within the specification range of:
+~600–1000 Ω @ 100 MHz
+Low DC resistance
+~0.5–2 A rating
+Replacement ferrite beads were salvaged from a donor Dell notebook mainboard, sourced from the 3.5 mm audio circuitry, a section known to use comparable EMI suppression components in the same 1206 package. The repair was successful; the device passed all post-repair testing and had no warranty returns.
 == Common Hardware Issues ==
@@ Line 87: / Line 152: @@
 * '''Resistance''' measurements are taken with the console powered off and disconnected from AC.
 * '''Voltage''' measurements are taken with the console connected to AC power and in the specified power state.
+==== Resistance Reference ====
+===== EDM-020 =====
+Advanced resistance-to-ground values on a working EDM-020 board.
+See high-res images below for full details.
+{| class="wikitable"
+|-
+| [[File:PS5_PCB_EDM-020_Side_A.jpg|250px]]
+| [[File:PS5_PCB_EDM-020_Side_B.jpg|250px]]
+|-
+| PS5 PCB EDM-020 Side A.
+| PS5 PCB EDM-020 Side B.
+|}
+==== Voltage Reference ====
+===== EDM-020 =====
+PS5 Voltage Reference Characterization During Idle State (User Select / Home Screen, Side B).
+{| class="wikitable"
+|-
+| [[File:PS5 PCB EDM-020 Side B voltage reading idle.jpg|250px]]
+| [[File:32mhz crystal under SIE CX090061GG.jpg|250px]]
+|-
+| PS5 PCB EDM-020 Side B.
+| Crystal oscillator under SIE CX09006 chip.
+|}
 === Standby Power Rails ===
@@ Line 142: / Line 236: @@
 This section should be used in conjunction with the '''Diagnostics and Troubleshooting''' section for effective fault isolation.
+== Service Manuals ==
+=== PlayStation®5 BOARD SERVICE MANUAL 1st edition for EDM-020 BOARD ===
+: [[File:863200180-sm-ps5-0043e-01-0-BOARD-SERVICE-MANUAL-1st-edition.pdf|thumb|EDM-020 Board Service Manual 1ste Edition (PDF).]]
 == Repair Notes ==
@@ Line 158: / Line 257: @@
 This page is provided for informational purposes only. Repairing electronic equipment involves risk of injury or damage. Always follow appropriate safety procedures.
-We are not responsible for any damage, injury, or loss resulting from the use of this information or any attempt to repair or modify equipment described on this page.
+This information is intended for professional repair technicians with appropriate training, tools, and experience.
+We are '''not responsible''' for any damage, injury, or loss resulting from the use of this information or any attempt to repair or modify equipment described on this page.