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* Cooling Overview of the cooling system overviewdesign* Fan types Blower-type centrifugal fan specifications and sizesairflow characteristics* Liquid metal thermal interface application notes* Dust accumulation within the cooling system === Advanced Thermal Design ===The cooling system appears well engineered, but the SoC generates significant heat under load. To minimize hotspot formation and maintain thermal conductivity, liquid metal is used as the thermal interface material due to its high thermal transfer performance. During SMD rework on the PS5 mainboard, one of the first noticeable characteristics is how effectively the PCB itself contributes to heat dissipation, with a substantial thermal mass. The only missing feature would have been an advanced dust filtration system. === Fan Type ===The system uses a blower-style centrifugal fan, chosen for its ability to generate high static pressure and sufficient airflow (CFM) required to cool the power-intensive SoC and dense heatsink assembly. While effective, this design also makes the console more susceptible to dust accumulation, as it draws air from the surrounding environment without a dedicated filtration system. === Liquid Metal ===Liquid metal does not dry out or degrade in the same way as traditional thermal pastes. However, it introduces its own drawbacks, primarily the need for proper containment and isolation, since it remains in a liquid state and can migrate or leak if not properly secured. The damage caused by leaked liquid metal is often almost irreversible, as it can creep under BGA packages, corrode pads, short components, and lead to significant repair challenges. === Dust Accumulation ===When used at floor level, the risk of dust intake increases significantly. Over time, dust can accumulate on the cooling fins, reducing airflow and heat dissipation. This can lead to a progressive thermal chain: initial thermal throttling, followed by reduced performance or stuttering, and in severe cases, an automatic thermal shutdown to protect the hardware. To mitigate these issues, it is recommended to keep the console elevated above floor level to reduce exposure to dust and improve long-term cooling performance. == Common thermal failure points== * Compact thermal design with limited heat dissipation headroom.* Dust accumulation obstructing airflow paths and reducing cooling efficiency.* SoC temperatures exceeding TjMax, triggering thermal throttling or abrupt shutdowns to prevent hardware damage.