PlayStation 5 (PS5)

Technical measurements and hardware details for PlayStation 5 repair and troubleshooting.

PlayStation 5 (PS5)

The PlayStation 5 (PS5) is a home video game console developed by Sony. This page focuses on hardware measurements, electrical characteristics, and technical details
intended to assist with diagnosing, troubleshooting, and repairing PlayStation 5 consoles.

Overview

The PlayStation 5 was released in two primary variants:

• Standard model with Ultra HD Blu-ray drive
• Digital Edition without optical drive

Internally, both models share largely identical core hardware, with differences mainly related to the optical drive assembly and chassis layout.

Models and Revisions

Known PS5 model families include:

• CFI-10xx (launch models)
• CFI-11xx
• CFI-12xx

Hardware layout, cooling solutions, and power supply designs may vary slightly between revisions.

Physical Measurements

• Console dimensions
• Weight (with and without optical drive)
• Heatsink and fan dimensions
• PCB size and layer count (where known)

Power and Electrical Characteristics

• AC input specifications
• Power supply output rails
• Standby and operational power consumption
• Typical fault-related voltage readings

Cooling and Thermal Design

• Overview of the cooling system design
• Blower-type centrifugal fan specifications and airflow characteristics
• Liquid metal thermal interface application notes
• Dust accumulation within the cooling system

Advanced Thermal Design

The cooling system appears well engineered, but the SoC generates significant heat under load. To minimize hotspot formation and maintain thermal conductivity, liquid metal is used as the thermal interface material due to its high thermal transfer performance. During SMD rework on the PS5 mainboard, one of the first noticeable characteristics is how effectively the PCB itself contributes to heat dissipation, with a substantial thermal mass. The only missing feature would have been an advanced dust filtration system.

Fan Type

The system uses a blower-style centrifugal fan, chosen for its ability to generate high static pressure and sufficient airflow (CFM) required to cool the power-intensive SoC and dense heatsink assembly. While effective, this design also makes the console more susceptible to dust accumulation, as it draws air from the surrounding environment without a dedicated filtration system.

Liquid Metal

Liquid metal does not dry out or degrade in the same way as traditional thermal pastes. However, it introduces its own drawbacks, primarily the need for proper containment and isolation, since it remains in a liquid state and can migrate or leak if not properly secured. The damage caused by leaked liquid metal is often almost irreversible, as it can creep under BGA packages, corrode pads, short components, and lead to significant repair challenges.

Correct Application

This is critically important for proper, long-term, stable operation of the device. Use cotton swabs (Q-tips) to carefully remove the old liquid metal, do not spill it. Clean the surface with isopropyl alcohol (IPA). When reapplying, use cotton swabs to spread the liquid metal evenly, as shown in the picture.

Apply 1g of LM.	Evenly spread carefully with q-tip.

Dust Accumulation

When used at floor level, the risk of dust intake increases significantly. Over time, dust can accumulate on the cooling fins, reducing airflow and heat dissipation. This can lead to a progressive thermal chain: initial thermal throttling, followed by reduced performance or stuttering, and in severe cases, an automatic thermal shutdown to protect the hardware.

To mitigate these issues, it is recommended to keep the console elevated above floor level to reduce exposure to dust and improve long-term cooling performance.

Common thermal failure points

• Compact thermal design with limited heat dissipation headroom.
• Dust accumulation obstructing airflow paths and reducing cooling efficiency.
• SoC temperatures exceeding TjMax, triggering thermal throttling or abrupt shutdowns to prevent hardware damage.

Internal Components

This section documents all internal components that were either missing (knocked off) or identified as faulty during inspection and repair.

HDMI Chip MN864739

• Markings Panasonic MN864739 MN864739 Pin Out.

EDM-020 DFN12 Protection Switch 5v VBUS

Is the Playstation's USB PD / VBUS current limiting protection IC. Markings AF01 AOZ1351DI-01 IC in DFN12 package.

AOZ1351DI-01 IC location on EDM-020.

EDM-010 SIE CX090061GG EMI/RFI suppression

The following components were identified during a repair of a PS5 console. Several surface-mount components had been knocked off the bottom side of the EDM-010 board revision, in the vicinity of the SIE CX090061GG IC. The components were reverse-engineered from the board to facilitate replacement.

EDM-010 SIE CX090061GG EMI/RFI suppression.	Ferrite beads from donor board.	Repair.

Replacing them with 1206-package ferrite beads within the specification range of: ~600–1000 Ω @ 100 MHz Low DC resistance ~0.5–2 A rating

Replacement ferrite beads were salvaged from a donor Dell notebook mainboard, sourced from the 3.5 mm audio circuitry, a section known to use comparable EMI suppression components in the same 1206 package. The repair was successful; the device passed all post-repair testing and had no warranty returns.

Common Hardware Issues

This section documents commonly observed hardware faults, such as:

• No power or intermittent power
• Overheating and shutdowns
• HDMI output failure
• Liquid metal leakage or migration
• Fan or power supply failure

Diagnostics and Troubleshooting

• Visual inspection guidance
• Basic electrical testing points
• Symptom-based fault isolation
• Known failure patterns by model revision

Power Rail Voltage and Resistance Reference

This section provides internal reference information for full-board voltage and resistance measurements across major PlayStation 5 power rails. It is intended for use during board-level diagnostics, fault isolation, and repair verification.

All measurements should be taken with proper ESD precautions and appropriate test equipment. Values may vary slightly depending on model revision, firmware state, and board condition.

Measurement Scope

Measurements documented in this section include:

• Standby power rails
• Primary system power rails
• Secondary and low-voltage logic rails
• Ground-to-rail resistance checks
• Powered-on voltage validation

Unless otherwise specified:

• Resistance measurements are taken with the console powered off and disconnected from AC.
• Voltage measurements are taken with the console connected to AC power and in the specified power state.

Resistance Reference

EDM-020

Advanced resistance-to-ground values on a working EDM-020 board. See high-res images below for full details.

PS5 PCB EDM-020 Side A.	PS5 PCB EDM-020 Side B.

Voltage Reference

EDM-020

PS5 Voltage Reference Characterization During Idle State (User Select / Home Screen, Side B).

PS5 PCB EDM-020 Side B.	Crystal oscillator.

Standby Power Rails

Standby rails are present when the console is connected to AC power but not fully powered on.

Documented characteristics include:

• Expected standby voltage levels
• Typical resistance-to-ground values
• Rails required for power-on sequencing
• Common faults related to missing or unstable standby power

Abnormal readings on standby rails often indicate issues within the power supply, standby regulators, or shorted downstream components.

Primary System Power Rails

Primary system rails supply power to major subsystems such as the SoC, memory, and storage.

This subsection documents:

• Nominal operating voltages
• Acceptable voltage tolerance ranges
• Typical resistance values for short detection
• Power sequencing dependencies

Significant deviations may indicate short circuits, failed regulators, or load-side faults.

Secondary and Low-Voltage Rails

Low-voltage rails support logic, control, and peripheral functions.

Included measurements:

• Logic-level supply rails
• Controller and interface voltages
• Always-on versus switched rails
• Resistance comparisons between known-good and faulty boards (where available)

These rails are often involved in no-boot, no-video, or intermittent power issues.

Ground Reference and Short Detection

Ground integrity and resistance-to-ground measurements are critical for diagnosing short circuits.

This subsection covers:

• Recommended ground reference points
• Interpreting low-resistance readings
• Differentiating normal low-impedance rails from true shorts
• Common short locations by rail type

Measurement Notes and Limitations

• Values provided are for reference and comparison purposes only.
• Differences between board revisions may affect expected readings.
• Environmental factors such as temperature can influence resistance measurements.
• Always confirm suspicious readings with multiple test points where possible.

This section should be used in conjunction with the Diagnostics and Troubleshooting section for effective fault isolation.

Service Manuals

PlayStation®5 BOARD SERVICE MANUAL 1st edition for EDM-020 BOARD

File:863200180-sm-ps5-0043e-01-0-BOARD-SERVICE-MANUAL-1st-edition.pdf

Repair Notes

• Disassembly considerations
• Connector and ribbon cable cautions
• Thermal interface handling
• Post-repair testing recommendations

See Also

• PlayStation 5 teardown
• Game console repair
• HDMI repair

Disclaimer

This page is provided for informational purposes only. Repairing electronic equipment involves risk of injury or damage. Always follow appropriate safety procedures.

This information is intended for professional repair technicians with appropriate training, tools, and experience.

We are not responsible for any damage, injury, or loss resulting from the use of this information or any attempt to repair or modify equipment described on this page.