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**This patent references the Model 250 as prior art and presents an improvement whereby less acid is used and it appears tighter control over the temperature. The Model 250 heats up a larger area where the IC is placed, this patent seems to describe heating only the acid jet reducing time to decapsulate.
 This image from the book "Product Integrity and Reliability in Design" appears to be a schematic of the Model 250.<br />[[File:John W. Evans, Jillian Y. Evans, Dong-su Ryu (auth.), John W. Evans, Jillian Y. Evans (eds.) - Product Integrity and Reliability in Design-Springer-Verlag London (2001).jpg]]<br /> <br />
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